发明名称 Multilayered resin plate and process for producing the same
摘要 <p>A cured resin plate which is reduced in undulation and has excellent flatness even when having a thickness of 100 mu m or larger or a size exceeding 2 inches; and a process for efficiently mass-producing the resin plate. The process comprises spreading a resinous coating fluid A on a support (5) having a smooth surface to form an unsolidified or solidified coating layer, spreading thereon a resinous coating fluid B which is the same as or different from the coating fluid A to form two or more superposed layers of the coating fluid B, and solidifying the layers (12, 22, and 42) separately or simultaneously to thereby form superposed resin layers (1, 2, and 4) adhered to each other which comprise two or more adjacent cured resin layers (1 and 2). The multilayered resin plate comprises superposed layers adhered to each other which are composed of a thermoset epoxy resin layer and superposed thereon a thermoset epoxy resin layer having a smaller thickness than that layer. The multilayered resin plate can be continuously produced by the process in which resinous coating fluids are spread. The resin plate can be reduced in undulation because it comprises cured resin layers superposed on each other. <IMAGE></p>
申请公布号 EP1118461(A2) 申请公布日期 2001.07.25
申请号 EP20000127354 申请日期 2000.12.13
申请人 NITTO DENKO CORPORATION 发明人 UMEHARA, TOSHIYUKI;SAKATA, YOSHIMASA
分类号 B32B27/08;B29C39/20;B29C41/32;B32B27/38;G02B1/10;(IPC1-7):B32B31/28 主分类号 B32B27/08
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