Method of producing a semiconductor device

摘要

A method of producing a semiconductor device characterized by the steps of: (a) forming a substrate (103) which makes contact with side surfaces of a semiconductor element (101) and surrounds the semiconductor element to hold the semiconductor element; (b) providing a wiring substrate (117) electrically connected to the semiconductor element (108) and having external connecting terminals (113b) for electrically connecting the semiconductor element (101) to an outside element; and (c) encapsulating the semiconductor element by a resin (104a).