发明名称 THERMOSETTING ADHESIVE MATERIAL
摘要 PURPOSE: To enable blending an insulating inorganic filler with a thermosetting adhesive material for connecting terminals installed at each opposing surface of opposing pair of base plates each other without reducing its toughness parameter. CONSTITUTION: This thermosetting adhesive material for connecting terminals installed at each opposing surface of the opposing pair of base plates each other and containing the thermosetting resin and the inorganic filler is characterized by that the blended amount of the insulating inorganic filler £a (vol.%)| and the elastic modulus of the thermosetting adhesive material after curing £E(GPa)/30deg.C| satisfy the following relative formula (1): 0.042a+0.9 < E < 0.106a+2.5, and that at the same time, the blended amount of the insulating inorganic filler £a (vol.%)| and the tensile elongation rate £d(%)| of the thermosetting adhesive material at 25deg.C after its curing satisfy the following relative formula (2): -0.072a+4 < d < -0.263a+1.
申请公布号 KR20010070278(A) 申请公布日期 2001.07.25
申请号 KR20000074523 申请日期 2000.12.08
申请人 SONY CHEMICALS CORPORATION 发明人 TAKEICHI MOTOHIDE;YAGI HIDEKAZU
分类号 C09J201/00;C09J9/00;C09J163/00;H01B1/20;H01B1/22;H01B1/24;H05K3/32;(IPC1-7):C09J9/00 主分类号 C09J201/00
代理机构 代理人
主权项
地址