发明名称 Photocurable pressure-sensitive adhesive composition and sheet thereof
摘要 An objective is to provide a pressure-sensitive adhesive composition which shows pressure-sensitive adhesive properties at ordinary temperature, has the ability to cure upon irradiation and after photocure exhibits improved bond strength relative to high-polarity adherends, such as PET, PVC and metals, and improved moist heat-resisting bond strength, a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet obtained from the aforementioned pressure-sensitive adhesive composition. A photocurable pressure-sensitive adhesive composition containing a polyester resin having a glass transition temperature (Tg) of 25 DEG C or above, a cationically photopolymerizable compound and a cationic photoinitiator.
申请公布号 AU2547101(A) 申请公布日期 2001.07.24
申请号 AU20010025471 申请日期 2001.01.10
申请人 SEKISUI CHEMICAL CO., LTD. 发明人 HIDEAKI ISHIZAWA;MUNEHIRO HATAI;MASAKAZU NAKATA;MOTOHIRO YAGI
分类号 C09J7/00;C09J7/02;C09J167/00 主分类号 C09J7/00
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