Substrate structure with solder balls array for assembly of chips on substrate, with marking grids for indicating positions of defective chips, for use in integrated circuits manufacture

摘要

A substrate (3) with solder balls array comprises a circumferential zone (31) provided with a set of grids (4), each comprising a set of squares corresponding to the positions of chips on the substrate for indicating the positions of defective chips. The substrate comprises zones (1D,2D,3D,1E,2E,3E,1F,2F,3F) corresponding to the squares of grid (4). If the zones (1D,2D,1E,2E) are defective, the operator can mark manually or by aid of a machine the corresponding squares of grid (4), so that the positions of defective chips are clearly indicated.