| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting structure of a surface-mount semiconductor switching element, which reduces radiation noise, prevents malfunction of a circuit and miniaturizes a printed board, and to provided a radiation structure of the surface-mount semiconductor switching element, which miniaturizes a radiating member, reduces cost, improves fitting work and improves radiation efficiency. SOLUTION: In surface-mount switching element Q2 and Q3, which are provided for the DC-AC conversion of a power unit and are connected in series, the source terminal S of the switching element Q2 is connected to the drain terminal D of the switching element Q3 at a neutral point pattern M and the mounting directions of the switching element Q2 and Q3 on the printed board differ. The switching element Q2 is mounted, so that the forming direction of the source terminal S (or a gate terminal G) matches the direction of an arrow F2. The switching element Q3 is mounted so that the forming direction of the source terminal S (or the gate terminal G) matches the direction of the arrow F3.
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