发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To control the amount of catalyst elements to trace amounts. SOLUTION: An a-Si film 3 is formed on a glass substrate 1 and nickel 5 which are used as catalyst elements are introduced in the film 3. The surface of the film 3 is oxidized into a thin film and the high-concentration nickels are moved on and in the film of the formed thin film oxide film 4. After the film 4 being existed with a large amount of the nickel 5 is removed, a the film 3 is heat-treated to perform a crystallization of the film 3. After phosphorus 8 is doped to the region other than the region which is used as an active region, of the film 3, a heating treatment is performed and the nickel 5 diffused in a crystalline silicon film 3a, are drawn into phosphorus-doped crystalline silicon regions 3b. A channel region is formed using the film 3a, obtained in such a manner. Thus, by removing a region of one part of the surface of the film 3, trance amounts of the nickel 5 only of a component introduced in the film 3 across the removed region are left in the film 3 and the amount of the nickel 5, which are introduced in the film 3, is controlled to trace amounts.</p>
申请公布号 JP2001196307(A) 申请公布日期 2001.07.19
申请号 JP20000002623 申请日期 2000.01.11
申请人 SHARP CORP 发明人 MAKITA NAOKI;MORIGUCHI MASAO
分类号 H01L21/20;G02F1/136;G02F1/1368;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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