| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable a post used for a chip-size package to be improved in bonding properties to a conductive ball formed on the post and to set a gloss on the conductive ball. SOLUTION: A second opening 18 in which a wiring layer 16 is exposed is formed, then a second seed layer 19 is formed, and a solder post 7 is formed with the seed layer 19 serving as a plating electrode. The post 7 and a conductive ball 8 are set substantially equal to each other in composition and formed in one piece. Brazing material is so regulated in composition as to slightly lower the melting point of the conductive ball, by which the conductive ball is given a higher gloss.</p> |
