| 摘要 |
PROBLEM TO BE SOLVED: To realize a structure for a contact and its manufacturing method for electrically connecting spherical electrode terminals of minute bare chips and BGAs. SOLUTION: A contact pin break preventing diaphragm 8 of an organic material is stacked on a wiring board 4, and minute contact pins 7 manufactured by plating or wire bonding are formed to a contact region 9. According to this contact structure, minute contact pins can be prevented from breaking, and satisfactory productivity is obtained, because the process of manufacturing printed boards and ceramic substrates can be utilized.
|
