| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a package of chip size at a low cost, where a conductor wiring is formed on the electrode forming surface side of a semiconductor chip to enlarge and electrode pitch and to especially provide a method of easily forming a wiring and bumps. SOLUTION: (1) A method of forming a semiconductor device composed of a semiconductor, a wiring forming metal foil, and a conductor wiring on the metal foil, an a method of forming a conductor wiring circuit on a semiconductor comprises a first process in which a wiring forming metal foil is laminated on the electrode forming surface of a semiconductor, a second process in which a resist wiring pattern is formed by photoetching the metal foil, a third process in which the metal foil is etched, and a fourth process in which the semiconductor is divided into separate devices. (2) A method of forming a semiconductor device in (1) where solder bumps are provided and a conductor wiring circuit on a semiconductor comprises an additional process in which solder bumps are formed. (3) A method of forming a semiconductor device in (1) where solder bumps are provided and a conductor wiring circuit on a semiconductor uses a wiring forming multilayered metal foilinstead of a wiring forming metal foil.
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