| 摘要 |
<p>A surface mount package for a microwave circuit is disclosed. The package has a port for transferring a signal from the microwave circuit to a printed circuit board. The package includes a base made from a dielectric material which includes vias which contain a conductive material and are electrically coupled to the ground potential of the printed circuit board. Conductive material is placed on the topside of the base forming a transmission line for carrying the signal in a transmission line mode. To facilitate operation in a transmission line mode, the length of the transmission line is a substantial portion of the wavelength of the signal. The transmission line provides electrical contact with a terminal of the microwave circuit and is electrically coupled to the port. Additionally, the transmission line forms an electromagnetic wave guiding structure. In one embodiment, the electromagnetic wave guiding structure operates in both grounded coplanar waveguide and microstrip mode where a second conductive material resides on the top side of the base and spaced a distance from the first conductive material. In such a configuration, a portion of the base separates the first and second conductive materials, and the second conductive material substantially surrounds the first conductive material of the transmission line.</p> |
