发明名称 PLASMA TREATMENT SYSTEM AND METHOD
摘要 It is an object to enhance the degree of freedom for the shape of an obtained magnetic field to enhance the inplane uniformity of thickness of first and second films when the first and second films are continuously formed on a substrate to be treated. A main electromagnetic coil 5 is provided outside of a plasma chamber 21 so as to be movable vertically by a lifting shaft 52. When plasma is produced in a vacuum vessel 2 by the electron cyclotron resonance between a microwave and a magnetic field to continuously deposit a film of a two-layer structure, which comprises an SiOF film and an SiO2 film, on a wafer W with the produced plasma, a process for forming the SiOF film is carried out while the main electromagnetic coil 5 is arranged so that the lower surface of the coil 5 is positioned at a lower position than the lower surface of a transmission window 23 by 139 mm, and a process for forming the SiO2 film is carried out while the main electromagnetic coil 5 is arranged so that the lower surface of the coil 5 is positioned at a lower position than the lower surface of the transmission 23 by 157 mm.
申请公布号 US2001008798(A1) 申请公布日期 2001.07.19
申请号 US19980153141 申请日期 1998.09.14
申请人 NAITO YOKO;AMANO HIDEAKI 发明人 NAITO YOKO;AMANO HIDEAKI
分类号 H05H1/46;C23C16/50;C23C16/511;C23F4/00;H01J37/32;H01L21/205;H01L21/302;H01L21/3065;H01L21/31;H01L21/316;(IPC1-7):H01L21/311 主分类号 H05H1/46
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