| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition method by which a film is uniformly deposited, e.g. on the surface of an insulating film with tight adhesion regardless of the material of a base layer, and, even in the case of the inside of a fine recessed part, the same can securely be buried therein and to provide a system therefor. SOLUTION: This method has a stage in which a hyperfine particle-dispersed solution in which hyperfine particles in which at least one part is composed of metals are dispersed into a solvent is prepared, a stage in which the hyperfine particle-dispersed solution is sprayed from a spray nozzle toward the surface of a substrate in a vacuum atmosphere, and the solvent contained in the hyperfine particle-dispersed solution is evaporated and is collided against the surface of the substrate and a stage in which the metals composing at least one part of the hyperfine particles collided against the surface of the substrate are bonded on the surface of the substrate.
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