发明名称 BLISTER PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a blister package which is in a structure wherein turned-up pieces of a blister main body are not loosened when the blister main body is held at a mount. SOLUTION: For the blister package which is composed of a blister main body 1 having an article housing part 1a and a mount for covering the surface of an opening of the article housing part with a plurality of turn-up pieces 3 each having tongues 2 at respective both ends thereof for holding the blister main body to the mount provided at the blister main body 1 and with incisions for inserting each of tongues 2 respectively therein formed at the mount, protuberant stripes 4 for reinforcement are formed respectively along each of edges between each of both ends of the turn-up pieces 3.
申请公布号 JP2001192063(A) 申请公布日期 2001.07.17
申请号 JP20000002899 申请日期 2000.01.11
申请人 SONY CORP 发明人 KONO YOSHITOSHI;TOYODA YOSHITERU
分类号 B65D75/36;(IPC1-7):B65D75/36 主分类号 B65D75/36
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