| 摘要 |
A microactuator array with an integrally formed package is disclosed. Because the package is made from the same material and at the same time as the actuator itself, no extra time or cost is associated with packaging. In addition, it is contemplated that the package may be configured to provide all the necessary interconnections and leads for addressing and distributing power the various layers in the microactuator stack. Thus no additional steps or cost are associated with electrical interconnection.
|
