Semiconductor chip package with fan-in leads

摘要

A microelectronic assembly includes a microelectronic element having a first surface including a central region and a peripheral region surrounding the central region, the microelectronic element including a plurality of contacts disposed in the central region. The microelectronic assembly also includes a compliant layer over the peripheral region of the first surface, the compliant layer having a bottom surface facing toward the first surface of the microelectronic element, a top surface facing upwardly away from the microelectronic element and one or more edge surfaces extending between the top and bottom surfaces. A plurality of flexible bond ribbons are disposed over the compliant layer so that the bond ribbons extend over the top surface and one or more of the edge surfaces and the bond ribbons electrically connect the contacts to conductive terminals overlying the top surface of the compliant layer.