Repairable flip chip semiconductor device, and method of manufacturing same

摘要

First, there are prepared a semiconductor chip with a group of solder bumps disposed on and joined to a surface thereof in a predetermined pattern, and a multilayer plate including a second layer as an electrically conductive layer and first and third layers disposed on respective opposite surfaces of the second layer and comprising metal layers of one metal. Then, the first layer and the third layer of the multilayer plate are etched in a predetermined pattern to form a first group of posts and a second group of posts which have a pattern identical to the pattern of the group of solder bumps. Then, semiconductor chip is positioned to hold the solder bumps in contact with the posts of the first group, and the solder bumps are melted to join the solder bumps to the posts of the first group. Thereafter, the second layer is cut between the posts of the first and second groups, producing separate multilayer posts.