WAFER CARRIER CLEANING APPARATUS FOR CHEMICAL MECHANICAL POLISHING SYSTEM

摘要

PURPOSE: A wafer carrier cleaning apparatus for a chemical mechanical polishing system is to remove a slurry stuck to a carrier thin film by injecting a water and directly contacting a brush, thereby reducing a maintenance cost and improving a rate of operation. CONSTITUTION: A chemical mechanical polishing process to a wafer is performed and a carrier thin film(21) for holding the wafer disposes a wafer carrier(20) installed in a wafer carrier head to a cleaning tank(31) of a tub(30), thereby removing a stuck slurry. A plurality of the first water injection units(I1) installed in a lower portion of the cleaning tank inject the water to the carrier thin film installed in the wafer carrier head. A brush(B2) installed in a direction vertical to a sidewall of the cleaning tank is contacted with the carrier thin film. The second water injection unit(I2) installed in a sidewall of the cleaning tank on an upper portion of the brush injects the wafer to a side face of the wafer carrier.