发明名称 |
WAFER RETAINER AND METHOD FOR ATTACHING/DETACHING THE WAFER RETAINER TO/FROM POLISHING MACHINE BASE PLATE |
摘要 |
A wafer retainer includes: a foam layer capable of adsorbing a wafer on a surface thereof in a detachable manner; a first pressure-sensitive adhesive layer formed on a back face of the foam layer; a support formed on a back face of the first pressure-sensitive adhesive layer; a second pressure-sensitive adhesive layer formed on a back face of the support for adhering to a base plate of a polishing machine; and a release sheet releasably attached to the second pressure-sensitive adhesive layer. The second pressure-sensitive adhesive layer includes an adhesive composition. The adhesive composition contains a pressure-sensitive adhesive and a side-chain crystallizable polymer so that the side-chain crystallizable polymer is present in an amount of about 1% to about 30% by weight based on the adhesive composition. The side-chain crystallizable polymer includes as a main component thereof an acrylic acid ester and/or methacrylic acid ester which has a straight-chain alkyl group including 16 or more carbon atoms as a side-chain. |
申请公布号 |
EP1114110(A1) |
申请公布日期 |
2001.07.11 |
申请号 |
EP19990940544 |
申请日期 |
1999.08.27 |
申请人 |
NITTA CORPORATION |
发明人 |
YAMAMOTO, MASAYOSHI;KASAZAKI, TOSHIAKI;TANI, NAOYUKI;KAWAHARA, SHINICHIRO;ANDO, TAKASHI |
分类号 |
B24B37/30;C08L33/08;C09J7/02;C09J133/00;C09J201/00;H01L21/304;H01L21/68;(IPC1-7):C09J7/02;B24B37/04;B24B41/06 |
主分类号 |
B24B37/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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