| 摘要 |
PROBLEM TO BE SOLVED: To provide an aligner which can quickly exchange a wafer and can improve the throughput. SOLUTION: Trenches 14B are made on a suction surface 4A of a check 14. The gas is filled in the trenches 14B by a gas supply source 19. The He gas, filled in the trenches 14B, can be evacuated by a vacuum pump 22 after opening a valve 24. An assuming part 32 of a gas control device 25 assumes a proper time when exhausting the trenches 14B of the check 14 is performed, based upon the stored result in a memory 30 or a calculated result of a calculation part 31. The exhausting for the trenches 14B of the check 14 starts by operating the vacuum pump 22 by opening the valve 24 at the time when the assuming part 32 assumes during exposure of a wafer 17.
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