| 摘要 |
A semiconductor device includes a semiconductor chip, a TAB tape, a stiffener, and a heat dissipation plate. The TAB tape has inner leads to be connected to electrodes of the semiconductor chip. The stiffener is adhered to the lower surface of the TAB tape to maintain flatness of the TAB tape. The heat dissipation plate has a surface on which the semiconductor chip and the stiffener surrounding the semiconductor chip are adhered. The heat dissipation plate dissipates heat generated by the semiconductor chip. The stiffener is molded with a synthetic resin material. A method of manufacturing a semiconductor device is also disclosed.
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