发明名称 |
METHOD FOR MANUFACTURING FLASH MEMORY DEVICE |
摘要 |
PURPOSE: A method for manufacturing a flash memory device is to reduce a manufacturing step by etching a predetermined region for forming a source at once and to improve an operation velocity of the device by enlarging an overlapped region between a source region and a gate region. CONSTITUTION: A substrate(31) having a field region(21) and a source region(23) is etched using an isolation oxide mask and a cell source mask. After carrying out a well forming process and an ion implanting process, a tunnel oxide film(32) is formed on the entire surface of the substrate. The first conductive layer(33) for a floating gate is formed on the entire surface of the substrate, and the first conductive layer positioned on the first conductive layer etching region is removed. A dielectric layer(34), the second conductive layer(35) for a control gate, and a reflection preventive layer are subsequently formed on the entire surface of the substrate. The second conductive layer is patterned so that a portion of the control gate is overlapped on the etched portion of a trench of the source region.
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申请公布号 |
KR20010061418(A) |
申请公布日期 |
2001.07.07 |
申请号 |
KR19990063912 |
申请日期 |
1999.12.28 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
LEE, JU YEOP;LEE, MIN GYU;PARK, BYEONG SU;SHIN, YEONG GI |
分类号 |
H01L27/115;(IPC1-7):H01L27/115 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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