发明名称 PRINTED WIRING BOARD CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board connecting structure in which the auxiliary substrate of a module, etc., can be extended and exchanged without increasing the thickness of the main substrate, such as the mother board, etc. SOLUTION: The connecting structure is contrived to mount a printed wiring board on a substrate and is constituted of a plurality of first connecting terminals provided at positions. The terminals support at least both ends of the wiring board on the side walls of the wiring board and a housing section which is provided on the substrate, houses the wiring board at a position lower than the surface of the substrate, and has second connecting terminals which are detachably engaged with the first connecting terminal on the side walls facing the first connecting terminals.
申请公布号 JP2001185830(A) 申请公布日期 2001.07.06
申请号 JP19990366900 申请日期 1999.12.24
申请人 RICOH CO LTD 发明人 MORI YOSHINORI
分类号 H05K1/11;H05K1/14;H05K3/36;H05K7/14;(IPC1-7):H05K1/14 主分类号 H05K1/11
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