| 摘要 |
The conditioning casing device (10) for a light-emitting diode (1) molded in the resin forming the casing, which comprises a window (14) of planar optical type, has a half-ball (2) of glass or plastic material having the index of refraction identical or close to that of the window, is bonded to the window and centered with respect to the emission surface (11') of semiconductor component (11) of the diode. The half-ball (2) is bonded to the optical window (14) by means of an adhesive (20) having the index of refraction identical or close to that of the window and the half-ball. The application of conditioning casing device is to an array of light-emitting diodes, each integrated in a casing device and positioned in front of a collimation lens projecting the image of semiconductor component to infinity, and a focussing lens designed to image the set of images from different diodes to the same point located in front of a set of collimation lenses.
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