APPARATUS AND METHOD OF ATTACHING SEMICONDUCTOR CHIP

摘要

PURPOSE: An apparatus and a method of attaching a semiconductor chip are to distribute uniformly an attaching unit on a bottom surface of the semiconductor chip and to realize an increased attaching force of the semiconductor chip. CONSTITUTION: A vacuum housing(18) is separated from an outer surface of a pickup tool(16) with a predetermined distance. A packing unit(20) is attached to a lower end of the vacuum housing. The vacuum housing is connected to an adsorbing unit. A semiconductor chip is adsorbed via a hole which is formed on the pickup tool. The semiconductor chip is lifted on the pickup tool. At the same time, the vacuum housing is moved toward the outside of a chip mounting region. The adsorbed semiconductor chip is pressed with a constant pressure. An attaching unit(14) is positioned between the semiconductor chip and the chip mounting region. The attaching unit is spread widely by the force of vacuum.