发明名称 |
Circuit-forming charging powder and multilayer wiring board using the same |
摘要 |
A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.
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申请公布号 |
US2001006756(A1) |
申请公布日期 |
2001.07.05 |
申请号 |
US20010794700 |
申请日期 |
2001.02.27 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KAMADA AKIHIKO;KATO ISAO;SAKAI NORIO |
分类号 |
H05K3/12;G03G9/08;H05K3/10;H05K3/46;(IPC1-7):G03G9/093 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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