发明名称 Circuit-forming charging powder and multilayer wiring board using the same
摘要 A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.
申请公布号 US2001006756(A1) 申请公布日期 2001.07.05
申请号 US20010794700 申请日期 2001.02.27
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KAMADA AKIHIKO;KATO ISAO;SAKAI NORIO
分类号 H05K3/12;G03G9/08;H05K3/10;H05K3/46;(IPC1-7):G03G9/093 主分类号 H05K3/12
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