| 摘要 |
A thin film magnetic head having a miniaturized slider, in which a wire connecting a head device with a bonding pad is free of a short circuit with an adjacent wire due to a ground layer for plating under a bump. A wire-insulating layer composed of an organic resin material and the like insulates the wires from each other and covers the upper layers thereof, and is provided with an opening so as to expose an end terminal. A manufacturing process is also disclosed.
|
