发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment apparatus that promptly lowers the temperature of a heating plate, while the infiltration of particles into a processing chamber and rise of the internal pressure of the processing chamber are prevented. SOLUTION: A heat treatment chamber S is formed by a cover body 64 covering a heating plate 51, and gas that generates hot atmosphere air flow is supplied through a supply port 71 into the heat treatment chamber S. At lowering the temperature of the heating plate 51, cooling gas is supplied from a plurality of nozzles 74 to the rear surface of the heating plate 51. A check- valve mechanism 90, that prevents the infiltration of the cooling gas into the heat treatment chambers S and allows discharge of the gas from the heat treatment chamber S, is provided to the outer peripheral side of the heating plate 51.
申请公布号 JP2001176764(A) 申请公布日期 2001.06.29
申请号 JP19990358748 申请日期 1999.12.17
申请人 TOKYO ELECTRON LTD 发明人 SHIRAKAWA HIDEKAZU
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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