HEAT CONDUCTION BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To solve a problem such that an additional wiring is required because a conductor patterns must be formed in such an arrangement in which all the conductor pattern is connected to the outer frame of a lead frame when the wiring pattern of the lead frame is formed by a forming die in a usual punching process. SOLUTION: A lead frame provided with an optional conductor wiring pattern which is formed on its surface by etching by the use of a metal plate of certain thickness is buried in resin so as to solve the above problem, an insulator composed of thermosetting resin and inorganic filler is exposed at the part of lead frame on which the above conductor wiring is not present, conductor wiring patterns of separate shapes are contained in the above conductor wiring patterns, a metal plate for dissipating heat through the intermediary of the insulator is buried in the other surface, and the edge face of the metal plate is protected by an insulator.