MULTILAYER WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be increased capacitor electrodes being provided between the layers in the wiring board in comparison to conventional electrodes, the manufacturing method of the multilayer wiring board and a semiconductor device. SOLUTION: A multilayer wiring board comprises a copper layer for a capacitor lower electrode (metal layer for a capacitor lower electrode) formed with more than one of recessed parts 101c, a dielectric layer (dielectric layer for a capacitor 102) formed on the layer 101, and a copper layer for a capacitor upper electrode (metal layer for a capacitor upper electrode) 103 formed on the layer 102.