| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in sensitivity, adhesion, chemical resistance, flexibility and property of not contaminating a plating bath and a method for producing a printed wiring board using the composition. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C1) a coumarin derivative of formula I and (C2) a boron salt compound of formula II as (C) a photopolymerization initiator system. The photosensitive resin composition is applied on a substrate and dried and a protective film is optionally disposed to obtain the photosensitive element. The printed wiring board is produced using the photosensitive element. In the formulae I and II, Z1-Z10 are each halogen, a 1-20C alkyl or the like; (m) is an integer of 0-2; and (n) is an integer of 0-4. |
