| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for providing a re-worker and an exclusively used heater separately from a production line at partial soldering of electronic components. SOLUTION: In a method of partially soldering electronic components, a plurality of electronic components mounted on a printed board 2 is made to re-flow in a heating furnace 7 on the production line, while the printed board 2 mounted with the parts 11 is arranged in a thermally shielding case 6 formed, in such a way that at least the top and bottom of the case 6 are surrounded by metallic sheets 31 and 32 having openings 4 at the spots corresponding to defectively soldered electronic components 11 mounted on the board 2 and the parts 11 are partially soldered by selectively heating the spots, corresponding to the defective parts 11 to a temperature higher than the melting point of solder through the openings 4 in the furnace 7.
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