| 摘要 |
<p>An exposure method and apparatus in which vibration of one of two movable stages constituting the apparatus little affects the other. X-axis sliders (19A, 20A) movable in the X direction are disposed on both sides in the Y direction of a wafer base (13). A first Y-axis slider (16A) movable in the Y direction is disposed on the X-axis sliders (19A, 20A). A first wafer stage (WST1) movable in the Y direction (scanning direction) is disposed along the Y-axis slider (16A). X-axis sliders (19B, 20B) are disposed parallel with the X-axis sliders (19A, 20A). A second Y-axis (16B) is disposed on the X-axis sliders (19B, 20B). A second wafer stage (WST2) is disposed movably along the Y-axis slider (16B). While exposure is being conducted on the first wafer stage (WST1), wafer change and wafer alignment are conducted on the second wafer stage (WST2).</p> |
