| 摘要 |
<p>A method for fabricating device chips from a thin sheet of pyroelectric material comprising the steps of forming device forming regions each having an electrode and circuit patterns for interconnecting the electrodes on both sides of a thin sheet of pyroelectric material to produce a device base, forming and grounding electrical connections between the circuit patterns to bring all the device forming regions into the same potential, blasting the device base to remove predetermined portions of the pyroelectric material while leaving crosspieces extending between adjacent device forming regions and having circuit patterns thereon so as to fabricate a device chip assembly where adjacent device chips are interconnected through the crosspieces, and separating the device chips from the device chip assembly by removing the crosspieces.</p> |
