| 摘要 |
PURPOSE: A semiconductor device is provided to enable a flip chip connection without an under fill and to form an interconnection of a high precision, by forming the interconnection on a desired insulation layer so that the width of the interconnection in an inclined part becomes thick. CONSTITUTION: The insulation layer is formed on the semiconductor device(13). An external connection terminal is formed on the insulation layer. The interconnection electrically connects a circuit electrode of the semiconductor device with the external connection terminal, formed on the insulation layer. The shape of a power interconnection or ground interconnection in the inclined part of the insulation layer is different from that of a signal interconnection. |
