发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a module semiconductor device which is raised its heat cycle life. SOLUTION: A module semiconductor device is constituted by bonding an insulating board 57 of a structure that semiconductor chips 51 are respectively bonded to the surface and rear of an insulative ceramic board 53 via conducting layers 55a and 55b to a base substrate 63 with a solder layer 6, and spacers 3 for making uniform the thickness of the layer 61 are provided between the board 57 and the substrate 63. |
申请公布号 |
JP2001168252(A) |
申请公布日期 |
2001.06.22 |
申请号 |
JP19990347884 |
申请日期 |
1999.12.07 |
申请人 |
SHIBAFU ENGINEERING KK;TOSHIBA CORP |
发明人 |
OKUTOMI ISAO;ISHIWATARI YUTAKA;TANAKA AKIRA;YAMAMOTO ATSUSHI;KUSANO TAKASHI |
分类号 |
H05K3/34;H01L23/40;H01L25/07;H01L25/18;H05K1/18;(IPC1-7):H01L23/40 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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