| 摘要 |
PROBLEM TO BE SOLVED: To prevent the heat of large-power parts from being transferred to a control circuit element such as a microcomputer easily while the heat is efficiently radiated to the outside. SOLUTION: An enclosure 12 is composed by joining a first split enclosure 17 with an opening 17a, a second split enclosure 18 being provided at the part of the opening 17a, and a lid part 19. In this case, a heat-insulating member 20 is held between the first and second split enclosures 17 and 18. A first substrate 13 where the large-power parts 15 are mounted is mounted to the first split enclosure 17 in a thermally connected state, and a second substrate 14 where a control circuit including a microcomputer 16 is mounted is mounted to the second split enclosure 18 in a thermally connected state. Cooling fins 21 and 22 are provided at the outer-wall parts of the first and second split enclosures 17 and 18.
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