发明名称 WATER-ELIMINATING DEVICE FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a water-eliminating device for a substrate, where the elimination efficiency of water adhering to the front and rear sides of the substrate such as a printed wiring board and the inside of a through-hole is stable. SOLUTION: Upper and lower rollers 1 and 2 that are arranged vertically, are in contact each other by a backup mechanism 4 for collapsing, pass a printed wiring board 8 between them for eliminating water adhering to the surface of the wiring board and a through-hole, and a squeegee for pressing a squeegee 6 to the throwing side of a printed wiring board 8 of the upper and lower rollers 1 and 2 of each roller by an actuator 5 and unloading water which is absorbed by a liquid-absorbing soft material 10 of each roller are provided, at the same time, a cavity 11 is provided inside a roller shaft 3a of each roller, and a drain hole 12 for unloading one portion of water being absorbed by the liquid-absorbing soft material 10 of each roller is provided at the wall, thus preventing the water content of the liquid-absorbing soft material 10 from saturation.
申请公布号 JP2001168499(A) 申请公布日期 2001.06.22
申请号 JP19990346184 申请日期 1999.12.06
申请人 NEC TOYAMA LTD 发明人 UOZU TORU
分类号 H05K3/26;(IPC1-7):H05K3/26 主分类号 H05K3/26
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