| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor laser element by which the time required for manufacturing the semiconductor laser element can be shortened and performance deterioration of the element caused, when the element is heated can be prevented and an installation substrate and a support substrate used for the element. SOLUTION: This semiconductor laser element is formed by sticking a laser chip 20, a sub-mount 30, and a heat sink 40 in a superimposed state. The laser chip 20 is constituted by forming a p-side electrode 2a and an n-side electrode 2b on the same surface of a crystalline substrate 21, and the sub-mount 30 is constituted by forming a front solder film 3a and a rear solder film 3b on the front and rear surfaces of a support body 31. When the laser chip 20, sub- mount 30, and heat sink 40 are laid upon another and heat and pressure are applied to them, the surface and rear solder films 3a and 3b melt and the chip 20, sub-mount 30, and sink 40 stick to each other in one process.</p> |
