| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem such that the frame of a separated lead frame flies off to have an adverse effect such as a reduction in productivity in the manufacture of a semiconductor device when leads are cut off with a rotary blade in place of a cutting die. SOLUTION: A connection part 13 as high as a sealing resin 8 is formed of the sealing resin 8 on the cutting line of a lead 4 which comes out of the sealing resin 8, a sealing resin is formed also on a runner, a lead frame is bonded to a resins heat 14, and the lead 4 is cut off by a rotary blade 15, and a frame is bonded to the resin sheet 14 with the connection part 13 after the lead 4 is cut off, so that a resin-sealed semiconductor device manufacturing method which is high in productivity, kept free from resin burrs and scattering of the cut frames can be obtained. |
