发明名称 |
COPPER SPUTTERING TARGET ASSEMBLY AND METHOD OF MAKING SAME |
摘要 |
Described is a sputtering target assembly of high purity copper diffusion bonded to a precipitation hardened aluminum alloy backing plate via an intermediate layer of a CuCr alloy and in which the copper contains a micro alloy addition of at least one of Ag, Su, Te, In, Mg, B, Bi, Sb and/or P. Also disclosed is a method that includes preparation of a master alloy for addition to high purity copper and fabricating, heat treating and diffusion bonding processes to produce a sputtering target assembly with a stable fine-grained target microstructure. |
申请公布号 |
WO0073531(A3) |
申请公布日期 |
2001.06.21 |
申请号 |
WO2000US15301 |
申请日期 |
2000.06.02 |
申请人 |
JOHNSON MATTHEY ELECTRONICS, INC. |
发明人 |
KARDOKUS, JANINE, K.;WU, CHI, TSE;PARFENIUK, CHRISTOPHER, L.;BUEHLER, JANE, E. |
分类号 |
B23K35/00;B23K35/30;C22C9/00;C23C14/34;H01J37/34;H01L21/28;H01L21/285 |
主分类号 |
B23K35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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