发明名称 |
Surface mounted conduction heat sink |
摘要 |
A system and method for conducting heat from electrical devices mounted on a circuit board is disclosed. A heat sink for conducting the heat is provided that includes a pair of substantially parallel vertical legs and a horizontal member coupled between the pair of substantially parallel vertical legs to form a "U" shape. The horizontal member includes an outer surface and an inner surface both having a layer of thermal interface material. The heat sink is surface mountable to a heat sink mounting pad on a surface of a printed circuit board. The heat sink mounting pad is adjacent to and thermally coupled to a heat transfer pad of an electronic device. The heat sink is thermally coupled to the electronic device.
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申请公布号 |
US6249434(B1) |
申请公布日期 |
2001.06.19 |
申请号 |
US20000597535 |
申请日期 |
2000.06.20 |
申请人 |
ADC TELECOMMUNICATIONS, INC. |
发明人 |
SCAFIDI CHRISTOPHER J. |
分类号 |
H05K1/02;H05K3/34;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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