发明名称 |
COOLING SYSTEM OF MODULE IC HANDLER |
摘要 |
PURPOSE: A cooling system of a module IC handler is provided to cool a module IC more rapidly by using an extra air jet during that the test is carried out in a tester portion by loading the module IC. CONSTITUTION: The cooling system of the module IC handler includes an air jet(100). The air jet(100) is composed of an air jet body(16), on the both sides of which a fixing portion(18) is formed, the first plate(22) and the second plate(24). An air ball(22) is installed between the first plate(22) and the second plate(24) in order that air is ventilated, which comes in through an air supplying pipe. The first plate(22) and the second plate(24) are formed in the air jet body(16) and a cover(26) is covered on the upper face and is fixed.
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申请公布号 |
KR20010047369(A) |
申请公布日期 |
2001.06.15 |
申请号 |
KR19990051558 |
申请日期 |
1999.11.19 |
申请人 |
MIRAE CORPORATION |
发明人 |
AHN, TAE SEONG;PARK, CHAN HO;SUNG, EUN HYEONG |
分类号 |
G01R31/26;G01R1/04;G01R1/44;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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