| 摘要 |
PURPOSE: To provide a polishing pad conditioner with no apprehension contaminating a silicon wafer at a relatively low cost of manufacture capable of rework (conditioning) of a polishing pad surface in suitable roughness, having a very long life, and capable of stably maintaining uniform conditioning. CONSTITUTION: This conditioner comprises a plurality of columnar diamonds 12 regularly arranged so as to be protruded in a work surface and a conductive bond member 14 integrally fixing the columnar diamond. The conductive bond member 14 comprises a conductive metal plate 15 having a plurality of holes 15 for burying the columnar diamond 12 and a conductive sintered metal with which a clearance is charged between the hole and the columnar diamond. In the conductive bond member, while making a conductive liquid flow between itself and an electrode opposed with a space apart, so that its electrolytic dressing can be performed.
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