发明名称 STRUCTURE AND METHOD FOR MANUFACTURING HIGH-BREAKDOWN VOLTAGE MOS TRANSISTOR
摘要 PURPOSE: To make a sustaining breakdown voltage higher in a high-breakdown voltage MOS transistor structure by constituting so that a substrate potential is less likely to become higher than the source potential. CONSTITUTION: While the concentrations and depths of the source- and drain-side offset diffusion layers 4d and 4s of a high-breakdown voltage MOS transistor are made equal to each other, the size of the source-side offset diffusion layer 4s is made larger than that of the drain-side offset diffusion layer 4d. In other words, dimensions Ld and Ls of the layers 4d and 4s are set as in the relation Ld < Ls. Therefore, the resistance value of the layer 4s becomes larger and the source voltage VS of the MOS transistor becomes higher. Consequently, a state, VW-(forward junction withstand voltage of silicon) <= VS (where, VW is the substrate voltage of the transistor), can be maintained easily and the sustaining breakdown voltage of the MOS transistor becomes high.
申请公布号 KR20010050605(A) 申请公布日期 2001.06.15
申请号 KR20000055938 申请日期 2000.09.23
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 INOUE HARUKO;KITAMURA YUICHI
分类号 H01L21/8234;H01L21/8238;H01L27/088;H01L27/092;H01L29/08;H01L29/78;(IPC1-7):H01L29/78 主分类号 H01L21/8234
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