| 摘要 |
PURPOSE: A wafer stage is provided to prevent a process defect and contamination of a process chamber caused by unashing in an ashing process, by changing the structure of the wafer stage where a wafer is settled. CONSTITUTION: A wafer stage(100) has a sink for settling a wafer(500). The sink is composed of an inclined sidewall(300), a bottom surface(200) and a groove(400) formed between the inclined sidewall and the bottom surface. The bottom surface is a circular bottom surface having a diameter smaller than that of the wafer. The groove is a ring-type groove formed along the outer circumference of the bottom surface to have a width larger than the difference between the diameter of the wafer and the diameter of the bottom surface. The inclined sidewall is extended from the outer edge of the groove upward, and has a broader diameter as it goes upward.
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