发明名称 |
SYSTEMS AND METHODS FOR APPLICATION OF ATMOSPHERIC PLASMA SURFACE TREATMENT TO VARIOUS ELECTRONIC COMPONENT PACKAGING AND ASSEMBLY METHODS |
摘要 |
This invention is related to a method for effecting metallic bond region modification in electronic components comprising metallic bond regions, the method comprising the steps of: transporting an electronic component having at least one metallic bond region through a primary gas atmosphere comprising unstable or excited gaseous species, the gaseous species being substantially devoid of any electrical charges, the primary gas atmosphere having a pressure ranging from about 0.5 x 10<5> Pa to about 3.0 x 10<5> Pa, thereby forming a treated electronic component. |
申请公布号 |
WO0141963(A2) |
申请公布日期 |
2001.06.14 |
申请号 |
WO2000US42454 |
申请日期 |
2000.12.01 |
申请人 |
L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET, L'EXPLOITATION DES PROCEDES GEORGES CLAUDE;SINDZINGRE, THIERRY;UNER, JASON, R. |
发明人 |
SINDZINGRE, THIERRY;UNER, JASON, R. |
分类号 |
H01L21/00;H01L21/60;H01L21/768 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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