| 摘要 |
The invention relates to a support element for an integrated circuit module to be fitted in a chip card comprising: a plate-shaped support body on whose one front flat side metallic contact surfaces are arranged, and on whose rear flat side the integrated circuit module is arranged; a protective layer which covers the integrated circuit module and which is made of an encapsulating material, and; an adhesive surface which is applied to the rear of the support body and which is provided for fastening the support element to the chip card. According to the invention, the adhesive layer covers the entire rear surface of the support element as an all-over adhesive layer. This inventive embodiment enables the production costs of said support elements to be significantly reduced. The invention also relates to a method for producing such a support element in which the all-over adhesive layer is attached to the support element by a pressing process effected by a pressing device having a pressing surface that is made of an elastic material. The pressing surface is flexible enough to permit the support element to submerge, in an all-over manner with the rear thereof which is provided with the integrated circuit module and with the protective layer that covers the same, into the pressing surface. |
