发明名称 |
Electronic package with compressible heatsink structure |
摘要 |
An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.
|
申请公布号 |
US6245186(B1) |
申请公布日期 |
2001.06.12 |
申请号 |
US19990225192 |
申请日期 |
1999.01.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ALCOE DAVID JAMES;SATHE SANJEEV BALWANT |
分类号 |
H05K7/20;H01L21/56;H01L23/12;H01L23/34;H01L23/36;H01L23/367;H01L23/373;H01L23/40;H01L23/433;(IPC1-7):B32B31/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|