METHOD OF MANUFACTURING MULTILAYER CERAMIC WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic wiring board at a low cost which has a flat surface suited for flip-chip-mounting semiconductor elements on the multilayer ceramic wiring board. SOLUTION: In the method of manufacturing a multilayer ceramic wiring board by thermocompression-bonding a laminate composed of a plurality of ceramic green sheets having through-holes and wirings formed thereon in one body and baking it at a specified temperature to obtain the multilayer ceramic wiring board, a rigid member is stuck to one surface of the laminate and a rigid member is stuck to the opposite surface through an elastic member and the sheet is thermocompression-bonded.